re: Hobby electronics info request
@starkatt (oh yeah and if you're trying to do BGA--which I strongly discourage, by the way, they're notoriously difficult to reflow even with proper equipment--you absolutely need to use lead-free solder paste if it's a lead-free BGA, and leaded if it's a leaded BGA. This restriction is not the case for other packages, just something to do with how the solder balls on a BGA package have to melt properly)
-F
re: Hobby electronics info request
@starkatt You may be limited in density unless you're able to get a very flat board finish with that process! We're not familiar with it. Bumps in the board can make it hard to solder parts in small-pitch surface mount packages.
-F
re: Hobby electronics info request
@Felthry I'm definitely planning on avoiding BGA, aiming for like QFN density at the most.
As far as ENIG -- that'd be rad but there's good odds these will ultimately be DIY etched polyamide boards.
Which may be an adventure since I haven't done etching before 😅